CASIC conducts cutting-edge research across multiple domains of semiconductor technology, from fundamental materials science to advanced system design. Our research is driven by both scientific curiosity and real-world industry needs.
Research on novel semiconductor materials including wide bandgap semiconductors, 2D materials, and quantum materials for next-generation electronic and photonic devices. Key research directions include: - Wide bandgap semiconductors (GaN, SiC) for power electronics - 2D materials (graphene, TMDCs) for flexible electronics - Quantum materials for computing and sensing - Novel heterostructures and interfaces
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Development of specialized hardware architectures for artificial intelligence and machine learning applications, focusing on energy efficiency and performance optimization. Key research directions include: - Neural network accelerators and AI inference chips - Neuromorphic computing systems - In-memory computing architectures - Edge AI and IoT devices
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Advanced IC design methodologies covering analog, digital, and mixed-signal circuits, with focus on AI accelerators, high-speed interfaces, and low-power design. Key research directions include: - High-speed serial interfaces and transceivers - Low-power analog and mixed-signal circuits - Digital signal processing architectures - EDA tools and design automation
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We mainly explores wide-bandgap (WBG) and ultra-wide bandgap (UWBG) materials, devices, and circuits for next-generation electronics applications. Our current research focuses on a few major areas: - WBG semiconductors for power and RF electronics; - Power device reliability and robustness, packaging, circuit-level integration, and system-level applications; - Machine learning assisted material-device-circuit co-design; - WBG and UWBG materials and devices for electronic, photonic, biological and quantum applications; - Devices, circuits and systems for extreme environment applications.
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Our research interests include, high-frequency power conversion and controls, high-density electronics packaging and magnetics integration, and power solutions for high performance computing, datacenter, electric vehicles and energy storage. - Power management solutions for high-performance computing and data centers; - High power density packaging and magnetici ntegration technologies for power electronics; - High-frequency power electronics topologies and control techniques based on wide-bandgap power (WBG) semiconductors; - Solid-state transformer (SST) technologies for DC microgrids; - Modeling and mitigation of electromagnetic interference (EMI) in power electronic systems.
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